TDK Corporation brings together TDK, EPCOS, InvenSense, Micronas, Tronics, Hutchinson Technology Inc. (HTI), and Chirp Microsystems branded sensors to present a comprehensive portfolio of sensor solutions.
TDK Corporation (TSE 6762) presents at Sensor+Test 2018 the full range of sensor products at one single booth to take another step towards its vision to become the worldwide number one provider of sensor solutions.
TDK Corporation (TSE:6762) is expanding its portfolio of TMR angle sensors with the TAD2140 type in a TO-6 package for automotive and industrial applications. The new sensor provides an innovative system-in-package solution for PCB-less applications. It includes two full TMR bridges, a dedicated ASIC for signal conditioning and integrated passive components.
TDK Corporation (TSE 6762) expands its Micronas Dual-Die Hall-effect sensor portfolio with the HAR 379x sensors for multidimensional magnetic field measurements in safety-critical automotive and industrial applications according to ISO 26262 rules.
ICsense, a TDK group company, is a leading supplier of analog, mixed-signal and high-voltage ASICs (Application Specific ICs). The company has filed another patent to strengthen its portfolio in innovative analog circuits.
TDK Corporation is represented during Embedded World 2018 trade show from February 27 to March 1 in Nuremberg, Germany, at booth 209 in hall 3A by its group companies TDK-Micronas, TDK-Lambda, TDK Europe, and InvenSense.
TDK Corporation and Asahi Kasei Microdevices Corporation (AKM) have jointly developed a highly accurate 3-axis magnetometer that combines an extremely sensitive tunnel magneto-resistive (TMR) element developed by TDK and an advanced electronic compass ASIC designed by AKM in a very small package.