TDK Corporation (TSE:6762) is putting the spotlight on innovation and the future at electronica 2018 from November 13 to 16 in Munich: Attracting Tomorrow! Under this motto and with three booths covering a total area of 850 square meters, TDK is showcasing its products and solutions for the segments Passive Components, Sensors and Power Supplies. At the TDK career booth visitors can learn about opportunities to join a leading global player in the electronics industry.
TDK Corporation brings together TDK, EPCOS, InvenSense, Micronas, Tronics, Hutchinson Technology Inc. (HTI), and Chirp Microsystems branded sensors to present a comprehensive portfolio of sensor solutions.
TDK Corporation (TSE 6762) presents at Sensor+Test 2018 the full range of sensor products at one single booth to take another step towards its vision to become the worldwide number one provider of sensor solutions.
TDK Corporation (TSE:6762) is expanding its portfolio of TMR angle sensors with the TAD2140 type in a TO-6 package for automotive and industrial applications. The new sensor provides an innovative system-in-package solution for PCB-less applications. It includes two full TMR bridges, a dedicated ASIC for signal conditioning and integrated passive components.
ICsense, a TDK group company, is a leading supplier of analog, mixed-signal and high-voltage ASICs (Application Specific ICs). The company has filed another patent to strengthen its portfolio in innovative analog circuits.
TDK Corporation is represented during Embedded World 2018 trade show from February 27 to March 1 in Nuremberg, Germany, at booth 209 in hall 3A by its group companies TDK-Micronas, TDK-Lambda, TDK Europe, and InvenSense.